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BGA-REBALL-PAD
BGA reballing silicone pad insulation mat universal BGA stencil Magnetic Base for CPU memory IC Chip soldering BGA reballing tools
| Price | 6.95 EUR |
|---|
BGA-REBALL-PAD is tool for holding the IC and stencil sligned.
The high temperature silicone is with embedded magnetic so it holds the stencil during the printing of the solder paste.
The high temperature silicone is with embedded magnetic so it holds the stencil during the printing of the solder paste.
FEATURES
- Anti slip, magnetic hold of the stencil
- Three depts for IC thickness 0.4, 0.5 and 0.8 mm
- High temperature up to 350C
- Dimensions: 118x86x10 mm
