Olimex Support Forum

OLinuXino Android / Linux boards and System On Modules => A13 => Topic started by: izzni on March 21, 2014, 09:40:42 pm

Title: FBGA Soldering Fesability or BGA Alternative for DDR3 Memory
Post by: izzni on March 21, 2014, 09:40:42 pm
I'm working on a project that will be using an A13. In this phase of the project the Olimex A13 board is perfect. In a later phase I need to reduce the size of the board (remove unneeded I/O connectors, VGA support, buttons, etc.). I would like to be able to prototype this without having to send PCBs out to be assembled.

I would assume the toaster oven reflow method would work on the fine pitched BGA DDR3 memory, assuming you get the piece placed correctly. Can anyone speak to the feasibility of soldering the FBGA memory on a prototype scale?

Is there a BGA alternative to the FBGA DDR3 memory used on the Olimex A13? The BGA has 0.8mm pitch, and would be more feasible to solder I would imagine.

Thanks!