STMP15x-SOM hardware changes

Notice that the schematic for STMP157-SOM-512-SB variant is different and named "STMP1-SOM-SB_Rev_x.pdf".

Notable hardware revision changes:

--- hardware revision E ---

1. AXP's pin<20>, EXTEN was connected to U5's EN pin<1> via the new added R60(22R/R0402)'s resistor - this should solve power up and start up problems;
2. R62 changed from 100k/R0402 to NA(100k/R0402);
3. C104 changed from 10uF/6.3V/20%/X5R/C0603 to NA(10uF/6.3V/20%/X5R/C0603);
4. CE sign added;
5. "TxD", "RxD", and "GND" texts added to the DBG1's connector in the bottom silk;
6. "+" and "-" signs added next to the LiPo_BAT1's connector in the bottom silk;
7. Revision code and release year were changed in the bottom silk as well;
8. MICRO_SD1 was moved 5mils towards the edge of the board for to correct the drill-to-drill error - 12mils minimum requirement!;
9. U3 changed from SY8089AAAC(SOT23-5) to TPS62A02ADRLR(SOT-563-6);
10. L2 changed from 2.2uH/1.5A/DCR=72mR/20%/3.00x3.00x1.50mm/CD32(NR3015T2R2M) to 1.0uH/2.5A/DCR=30mR/20%/3.00x3.00x1.50mm/CD32(SWPA3015S1R0MT);
11. C41 changed from 10uF/6.3V/20%/X5R/C0603 to 22uF/6.3V/20%/X5R/C0603;
12. U5 changed from SY8089AAAC(SOT23-5) to TPS62A02ADRLR(SOT-563-6);
13. L5 changed from 2.2uH/1.5A/DCR=72mR/20%/3.00x3.00x1.50mm/CD32(NR3015T2R2M) to 1.0uH/2.5A/DCR=30mR/20%/3.00x3.00x1.50mm/CD32(SWPA3015S1R0MT);
14. C56 changed from 10uF/6.3V/20%/X5R/C0603 to 22uF/6.3V/20%/X5R/C0603;

--- hardware revision D1 ---

1. R62 changed from 10k to 100k/0402. This delays 3.3V going to the pull-up resistors of the I2C. 
This fixes power up hangs of some boards but increases the time needed between power ups for discharging. 
There should be at least 2 or 3 seconds between power down and power up.

--- hardware revision D ---

1. Revision identifier changed to Rev_D and year to 2022;
2. DBG1 hanged from NA(HN1x3) to HR1x3;
3. The SMD boot jumpers: BOOT0_VDD1, BOOT1_VDD1 and BOOT2_VDD1 were deleted. 
R18(2.2k/0402) and R19(2.2k/0402) were deleted too. Instead added the BOOT switch: BOOT_SW1(DSHP04TS-S)
and R17 changed from 2.2k/R0402 to 330R/R0402;
4. Test pads for all power supplies added;
5. R18(10k/R0402) added to the AXP209's IRQ pin;
6. Added R19(0R/R0402) between AXP209's PWROK and MCU's NRST pin;
7. C32 moved 30mils far away from the SD-Card. R22 moved 70mils to the same direction. R21 moved too;
8. Added CE mark was added;
9. Layers numeration added;
10. U1 changed from STM32MP157CAA3x to STM32MP15x.